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STPS3150 Datasheet(PDF) 5 Page - STMicroelectronics |
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STPS3150 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 10 page  STPS3150 Characteristics 5/10 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB) Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (DO-201AD) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB flat) R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S (cm²) Cu SMB R (°C/W) th 0 10 20 30 40 50 60 70 80 90 5 1015 2025 Rth(j-I) Rth(j-a) L (mm) leads DO-201AD 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S (cm²) CU SMB flat R (°C/W) th(j-a) |
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