SGM8061 datasheet(3/14 Pages) SGMICRO | 500MHz, Rail-to-Rail Output CMOS Operational Amplifier

3 page

SGM8061/2/3

３

PACKAGE/ORDERING INFORMATION

MODEL

ORDER

NUMBER

PACKAGE

DESCRIPTION

PACKAGE

OPTION

MARKING

INFORMATION

SGM8061XN5/TR

SOT23-5

Tape and Reel, 3000

8061

SGM8061

SGM8061XS/TR

SO-8

Tape and Reel,2500

SGM8061XS

SGM8062

SGM8062XS/TR

SO-8

Tape and Reel, 2500

SGM8062XS

SGM8063XN6/TR

SOT23-6

Tape and Reel,3000

8063

SGM8063

SGM8063XS/TR

SO-8

Tape and Reel,2500

SGM8063XS

ABSOLUTE MAXIMUM RATINGS

Supply Voltage, V+ to V- .......................................... 7.5 V

Common-Mode Input Voltage

........................................ (–VS) – 0.5 Vto (+VS) +0.5V

Storage Temperature Range ................. –65℃ to +150℃

Junction Temperature .............................................. 160℃

Operating Temperature Range ............ –55℃ to +150℃

Package Thermal Resistance @ TA = 25℃

SOT23-5, θJA......................................................... 190 /W

℃

SOT23-6, θJA......................................................... 190 /W

℃

SO-8, θJA................................................................ 125 /W

℃

Lead Temperature Range (Soldering 10 sec)

...................................................... 260℃

ESD Susceptibility

HBM...........................................................................1000V

MM...............................................................................400V

NOTES

1. Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD.

Shengbang Micro-electronics recommends that all

integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance

degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage

because very small parametric changes could cause the

device not to meet its published specifications.

Part Number	Components Description	Html View	Manufacturer
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