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FMA3011 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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FMA3011 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
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2 / 9 page  Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 2 Datasheet v4.0 FMA3011 ABSOLUTE MAXIMUM RATINGS: Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device. PAD LAYOUT: PARAMETER SYMBOL ABSOLUTE MAXIMUM Max Input Power Pin +25dBm Gate Voltage VG1 -2V Drain Voltage VDD +10V Power Dissipation Pdiss 3.5W Operating Temp Toper -40°C to +85°C Storage Temp Tstor -55°C to +150°C PAD REF PAD NAME DESCRIPTION PIN COORDINATES (µm) A I RF in (96,503) B D1A 1st Stage Drain (671,2068) C G23A 2nd and 3rd Gate (1721, 2068) D D2AA 2nd Drain Direct (2171,2068) E D2AB 2nd Drain With Resistor (2321,2068) F D3AB 3rd Drain With Resistor (2471,2068) G D3AC Alt 3rd Drain Direct (3198,2040) H D3AA 3rd Stage Drain Direct (3560,2068) I O RF Output (3604,1698) J D3BA 3rd Stage Drain Direct (3560,132) K D3BC Alt 3rd Drain Direct (3198,160) L D3BB 3rd Drain With Resistor (2471,132) M D2BB 2nd Drain With Resistor (2321,132) N D2BA 2nd Drain Direct (2171,132) O G23B 2nd and 3rd Gate (1721,132) P D1B 1st Stage Drain (671,132) H G D E F B C I A P O NML K J Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening. Pads without identifiers are ground connections used in wafer testing. DIE SIZE ( µm) DIE THICKNESS ( µm) MIN. BOND PAD PITCH ( µm) MIN. BOND PAD OPENING ( µm x µm ) 3700 x 2200 100 150um 100 x 100 |
Similar Part No. - FMA3011_1 |
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Similar Description - FMA3011_1 |
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