ADCMP580/ADCMP581/ADCMP582

Rev. A | Page 7 of 16

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Q

PIN 1

INDICATOR

1

2

3

4

11 Q

12 GND

10

9GND

ADCMP580

TOP VIEW

(Not to Scale)

Figure 3. ADCMP580 Pin Configuration

Q

PIN 1

INDICATOR

1

2

3

4

11 Q

12 GND

10

9GND

ADCMP581

TOP VIEW

(Not to Scale)

Figure 4. ADCMP581 Pin Configuration

Q

PIN 1

INDICATOR

1

2

3

4

11 Q

10

ADCMP582

TOP VIEW

(Not to Scale)

Figure 5. ADCMP582 Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

Termination Resistor Return Pin for VP Input.

2

Noninverting Analog Input.

3

Inverting Analog Input.

4

5, 16

Positive Supply Voltage.

6

LE

Latch Enable Input Pin, Inverting Side. In compare mode (LE = low), the output tracks changes at the input of

the comparator. In latch mode (LE = high), the output reflects the input state just prior to the comparator being

placed into latch mode. LE must be driven in complement with LE.

7

LE

Latch Enable Input Pin, Noninverting Side. In compare mode (LE = high), the output tracks changes at the

input of the comparator. In latch mode (LE = low), the output reflects the input state just prior to the

comparator being placed into latch mode. LE must be driven in complement with LE.

8

Termination Return Pin for the LE/LE Input Pins.

For the ADCMP580 (CML output stage), this pin should be connected to the GND ground.

For the ADCMP581 (ECL output stage), this pin should be connected to the –2 V termination potential.

9, 12

Digital Ground Pin/Positive Logic Power Supply Terminal.

For the ADCMP580/ADCMP581, this pin should be connected to the GND pin.

10

Q

(Pin 6 to Pin 7) for more information.

11

Q

descriptions (Pin 6 to Pin 7) for more information.

13

Negative Power Supply.

14

HYS

suitably sized resistor to add the desired amount of hysteresis. Refer to Figure 9 for proper sizing of the HYS

hysteresis control resistor.

15

GND

Analog Ground.

Heat Sink

Paddle

N/C

The metallic back surface of the package is not electrically connected to any part of the circuit. It can be left

floating for optimal electrical isolation between the package handle and the substrate of the die. It can also

be soldered to the application board if improved thermal and/or mechanical stability is desired. Exposed metal

at package corners is connected to the heat sink paddle.