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Die Characteristics

DIE DIMENSIONS

2440

µm x 2860µm x 485µm

METALLIZATION

Type: CuAl

Thickness: 16k

PASSIVATION

Type: Nitride Over Silox

Nitride Thickness: 3.5k

Silox Thickness: 12k

WORST CASE CURRENT DENSITY

Metallization Mask Layout

HI-201HS

A1

A2

OUT2

IN2

V+

IN3

OUT3

A3

A4

OUT4

IN4

GND

V-

IN1

OUT1

HI-201HS