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HI9P0509-5 Datasheet(PDF) 2 Page - Intersil Corporation |
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HI9P0509-5 Datasheet(HTML) 2 Page - Intersil Corporation |
2 / 24 page 2 FN3142.8 October 30, 2007 Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HI1-0506-2 HI1-506-2 -55 to +125 28 Ld CERDIP F28.6 HI1-0506-5 HI1-506-5 0 to +75 28 Ld CERDIP F28.6 HI4P0506-5 HI4P 506-5 0 to +75 28 Ld PLCC N28.45 HI4P0506-5Z (Note 1) HI4P 506-5Z 0 to +75 28 Ld PLCC (Pb-free) N28.45 HI9P0506-5 HI9P506-5 0 to +75 28 Ld SOIC M28.3 HI9P0506-9 HI9P506-9 -40 to +85 28 Ld SOIC M28.3 HI9P0506-9Z (Note 1) HI9P506-9Z -40 to +85 28 Ld SOIC (Pb-free) M28.3 HI1-0507-2 HI1-507-2 -55 to +125 28 Ld CERDIP F28.6 HI3-0507-5 HI3-507-5 0 to +75 28 Ld PDIP E28.6 HI3-0507-5Z HI3-507-5Z 0 to +75 28 Ld PDIP (Note 3) (Pb-free) E28.6 HI1-0508-2 HI1-508-2 -55 to 125 16 Ld CERDIP F16.3 HI1-0508-5 HI1-508 0 to +75 16 Ld CERDIP F16.3 HI3-0508-5 HI3-508-5 0 to +75 16 Ld PDIP E16.3 HI3-0508-5Z (Note 1) HI3-508-5Z 0 to +75 16 Ld PDIP (Note 3) (Pb-free) E16.3 HI9P0508-5 HI9P508-5 0 to +75 16 Ld SOIC M16.15 HI9P0508-5Z (Notes 1, 2) HI9P508-5Z 0 to +75 16 Ld SOIC (Pb-free) M16.15 HI9P0508-9 HI9P508-9 -40 to +85 16 Ld SOIC M16.15 HI9P0508-9Z (Note 1) HI9P508-9Z -40 to +85 16 Ld SOIC (Pb-free) M16.15 HI1-0509-2 HI1-509-2 -55 to +125 16 Ld CERDIP F16.3 HI1-0509-4 HI1-509-4 -25 to +85 16 Ld CERDIP F16.3 HI1-0509-5 HI1-509-5 0 to +75 16 Ld CERDIP F16.3 HI3-0509-5 HI3-509-5 0 to +75 16 Ld PDIP E16.3 HI4P0509-5 HI4P 509-5 0 to +75 20 Ld PLCC N20.35 HI4P0509-5Z (Notes 1, 2) HI4P 509-5Z 0 to +75 20 Ld PLCC (Pb-free) N20.35 HI9P0509-5 HI9P 509-5 0 to +75 16 Ld SOIC M16.15 HI9P0509-5Z (Notes 1, 2) HI9P 509-5Z 0 to +75 16 Ld SOIC (Pb-free) M16.15 NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Add “96” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 3. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. HI-506, HI-507, HI-508, HI-509 |
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