2

FN7386.5

September 13, 2007

Ordering Information

PART NUMBER

PART MARKING

PACKAGE

PKG. DWG. #

EL5156IS

5156IS

8 Ld SOIC (150 mil)

MDP0027

EL5156IS-T7*

5156IS

8 Ld SOIC (150 mil)

MDP0027

EL5156IS-T13*

5156IS

8 Ld SOIC (150 mil)

MDP0027

EL5156ISZ (Note)

5156ISZ

8 Ld SOIC (150 mil) (Pb-free)

MDP0027

EL5156ISZ-T7* (Note)

5156ISZ

8 Ld SOIC (150 mil) (Pb-free)

MDP0027

EL5156ISZ-T13* (Note)

5156ISZ

8 Ld SOIC (150 mil) (Pb-free)

MDP0027

EL5157IW-T7*

BHAA

5 Ld SOT-23

MDP0038

EL5157IW-T7A*

BHAA

5 Ld SOT-23

MDP0038

EL5157IWZ-T7* (Note)

BAAM

5 Ld SOT-23 (Pb-free)

MDP0038

EL5157IWZ-T7A* (Note)

BAAM

5 Ld SOT-23 (Pb-free)

MDP0038

EL5256IY

BAHAA

10 Ld MSOP (3.0mm)

MDP0043

EL5256IY-T7*

BAHAA

10 Ld MSOP (3.0mm)

MDP0043

EL5256IY-T13*

BAHAA

10 Ld MSOP (3.0mm)

MDP0043

EL5257IS

5257IS

8 Ld SOIC (150 mil)

MDP0027

EL5257IS-T7*

5257IS

8 Ld SOIC (150 mil)

MDP0027

EL5257IS-T13*

5257IS

8 Ld SOIC (150 mil)

MDP0027

EL5257IY

BAJAA

8 Ld MSOP (3.0mm)

MDP0043

EL5257IY-T7*

BAJAA

8 Ld MSOP (3.0mm)

MDP0043

EL5257IY-T13*

BAJAA

8 Ld MSOP (3.0mm)

MDP0043

*Please refer to TB347 for details on reel specifications.

NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%

matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J

STD-020.

EL5156, EL5157, EL5256, EL5257