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TE28F160C3BC70 Datasheet(PDF) 5 Page - Intel Corporation |
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TE28F160C3BC70 Datasheet(HTML) 5 Page - Intel Corporation |
5 / 68 page Datasheet 5 Contents Revision History Date of Revision Version Description 05/12/98 -001 Original version 07/21/98 -002 48-Lead TSOP package diagram change µBGA package diagrams change 32-Mbit ordering information change (Section 6) CFI Query Structure Output Table Change (Table C2) CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and Command Support change (Table C8) Protection Register Address Change IPPD test conditions clarification (Section 4.3) µBGA package top side mark information clarification (Section 6) 10/03/98 -003 Byte-Wide Protection Register Address change VIH Specification change (Section 4.3) VIL Maximum Specification change (Section 4.3) ICCS test conditions clarification (Section 4.3) Added Command Sequence Error Note (Table 7) Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory Family. 12/04/98 -004 Added tBHWH/tBHEH and tQVBL (Section 4.6) Programming the Protection Register clarification (Section 3.4.2) 12/31/98 -005 Removed all references to x8 configurations 02/24/99 -006 Removed reference to 40-Lead TSOP from front page 06/10/99 -007 Added Easy BGA package (Section 1.2) Removed 1.8 V I/O references Locking Operations Flowchart changed (Appendix B) Added tWHGL (Section 4.6) CFI Primary Vendor-Specific Extended Query changed (Appendix C) 03/20/00 -008 Max ICCD changedto25µA Table 10, added note indicating VCCMax = 3.3 V for 32-Mbit device 04/24/00 -009 Added specifications for 0.18 micron product offerings throughout document Added 64-Mbit density 10/12/00 -010 Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product offering. Changed VccMax=3.3V reference to indicate that the affected product is the 0.25 µm 32Mbit device. Minor text edits throughout document. 7/20/01 -011 Added 1.8v I/O operation documentation where applicable Added TSOP PCN ‘Pin-1’ indicator information Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’ Added ‘Vssq’ to Pin Descriptions Information Removed 0.4 µm references in DC characteristics table Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA Corrected ‘bottom’ parameter block sizestoon8Mb deviceto8x4KWords Minor text edits throughout document 10/02/01 -012 Added specifications for 0.13 micron product offerings throughout document 2/05/02 -013 Corrected Iccw / Ippw / Icces /Ippes values. Added mechanicals for 16Mb and 64Mb Minor text edits throughout document. |
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