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ISL55110_0712 Datasheet(PDF) 3 Page - Intersil Corporation

Part No. ISL55110_0712
Description  Dual, High Speed MOSFET Driver
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Maker  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
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 3 page
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3
FN6228.2
December 12, 2007
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VH+ to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
VIN_A, VIN_V, PDN, ENABLE. . . . . . (GND - 0.5V) to (VDD + 0.5V)
OA, OB. . . . . . . . . . . . . . . . . . . . . . . . . . .(GND - 0.5) to (VH + 0.5V)
Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . (300mA)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Thermal Resistance
θJA (°C/W) θJC (°C/W)
16 Ld (4x4) QFN Package (Notes 2, 3)
45
3.0
8 Ld TSSOP Package (Note 1) . . . . . .
140
N/A
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Recommended Operating Conditions
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 4)
TYP
MAX
(Note 4)
UNIT
VH
Driver Supply Voltage
5
12
13.2
V
VDD
Logic Supply Voltage
2.7
5.5
V
TA
Ambient Temperature
-40
+85
°C
TJ
Junction Temperature
+150
°C
DC Electrical Specifications
VH = +12V, VDD = 2.7V to 5.5V, TA = +25°C, unless otherwise specified.
PARAMETER
DESCRIPTION
TEST CONDITIONS
MIN
(Note 4)
TYP
MAX
(Note 4)
UNITS
LOGIC CHARACTERISTICS
VIX_LH
Logic Input Threshold - Low to High
lIH = 1µA: VIN_A, VIN_B
1.32
1.42
1.52
V
VIX_HL
Logic Input Threshold - High to Low
lIL = 1µA: VIN_A, VIN_B
1.12
1.22
1.32
V
VHYS
Logic Input Hysteresis
VIN_A,VIN_B
0.2
V
VIH
Logic Input High Threshold
PDN
2.0
VDD
V
VIL
Logic Input Low Threshold
PDN
0
0.8
V
VIH
Logic Input High Threshold
ENABLE - QFN only
2.0
VDD
V
VIL
Logic Input Low Threshold
ENABLE - QFN only
0
0.8
V
IIX_H
Input Current Logic High
VIN_A,VIN_B = VDD
10
20
nA
IIX_L
Input Current Logic Low
VIN_A, VIN_B = 0V
10
20
nA
II_H
Input Current Logic High
PDN = VDD
10
20
nA
II_L
Input Current Logic Low
PDN = 0V
10
15
nA
II_H
Input Current Logic High
ENABLE = VDD (QFN only)
12
mA
II_L
Input Current Logic Low
ENABLE = 0V (QFN only)
-25
nA
ISL55110, ISL55111




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