Electronic Components Datasheet Search |
|
LM3520SD Datasheet(PDF) 6 Page - National Semiconductor (TI) |
|
|
LM3520SD Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 14 page Electrical Characteristics (Notes 6, 7) Limits in standard typeface are for T J = +25˚C. Limits in boldface type apply over the full operating junction temperature range (−40˚C ≤ =T J ≤ +125˚C). Unless otherwise noted: specifications apply to the LM3520. V IN = 3.6V, V(En) > 1.0V, CIN = 10 µF (Note 8). (Continued) Symbol Parameter Conditions Min Typ Max Units OVP Output Over-Voltage Protection ON Threshold 22.2 23.2 24.2 V (Main & Sub Displays) OFF Threshold 21.5 22.5 23.5 UVP Input Under-Voltage Protection ON Threshold 2.3 2.4 2.5 V OFF Threshold 2.35 2.45 2.55 I Vout_main_leak V OUT Leakage Current V OUT =VIN, MAIN_EN = SUB_EN = 0V 0.1 nA I Vout_main_bias V OUT Bias Current at No Load V OUT = 20V, SUB_EN = 0 60 150 µA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: Enable signal must not be higher than Input voltage. Note 3: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125 oC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX). Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Note 5: Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6mm x 76.2mm x 1.6mm. Thickness of the copper layers are 2oz/1oz/1oz/2oz. The middle layer of the board is 60mm x 60mm. Ambient temperature in simulation is 22˚C, still air. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Note 6: All voltage is with respect toGND. Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 8: CIN and COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Note 9: Feedback current flows out of the Sub_ FB pin. Note 10: Current flows into the pin. www.national.com 6 |
Similar Part No. - LM3520SD |
|
Similar Description - LM3520SD |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |