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CY7C1011CV33
Document Number: 38-05232 Rev. *F
Page 5 of 14
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
8
pF
COUT
Output Capacitance
8pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
TSOP II
TQFP
FBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
44.56
42.66
46.98
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
10.75
14.64
9.63
°C/W
AC Test Loads and Waveforms
Figure 4. AC Test Loads and Waveforms [3]
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
3.3V
OUTPUT
30 pF*
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
(b)
R 317
Ω
R2
351
Ω
Rise Time: 1 V/ns
Fall Time: 1 V/ns
30 pF*
OUTPUT
Z = 50
Ω
50
Ω
1.5V
(c)
(a)
3.3V
OUTPUT
5 pF
(d)
R 317
Ω
R2
351
Ω
10-ns devices:
12-, 15-ns devices:
High-Z characteristics:
Note
3. AC characteristics (except High-Z) for 10-ns parts are tested using the load conditions shown in Figure 4 (a). All other speeds are tested using the Thevenin load shown
in Figure 4 (b). High-Z characteristics are tested for all speeds using the test load shown in Figure 4 (d).
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