NCP1207A, NCP1207B

http://onsemi.com

3

Figure 2. Internal Circuit Architecture

+

-

HV

GND

Drv

Demag

-

+

Fault

Mngt.

+

-

7.0

mA

To Internal

Supply

+

12 V, 10 V,

5.3 V (fault)

PON

4.5/1.5

ms

Delay

+

+

5.0 V

OVP

/1.44

8/4.5

ms

Blanking

-

+

5.0

ms

Timeout

Demag

Demag

Overload?

Timeout

Reset

S

R

S*

Q

R*

Q

380 ns

L.E.B.

/3

1.0 V

10 V

50 mV

CS

FB

200

mA

when Drv

is OFF

Driver: src = 20

sink = 10

*S and R are level triggered whereas S is edge

triggered. R has priority over the other inputs.

4.2 V

Soft-Start = 1 ms

-

+

+

VUVLO

MAXIMUM RATINGS

Rating

Symbol

Value

Units

20

V

25

V

Maximum Voltage on Pin 5 (Drv)

-

20

V

-

-0.3 to 10

V

activated

-

5.0

mA

Maximum Current in Pin 1

Idem

+3.0/-2.0

mA

Thermal Resistance, Junction-to-Case

57

°C/W

Thermal Resistance, Junction-to-Air, SOIC version

178

°C/W

Thermal Resistance, Junction-to-Air, DIP8 version

100

°C/W

Operating Junction Temperature

-40 to +125

°C

Maximum Junction Temperature

150

°C

Temperature Shutdown

-

155

°C

Hysteresis in Shutdown

-

30

°C

Storage Temperature Range

-

-60 to +150

°C

ESD Capability, HBM Model (All pins except HV)

-

2.0

kV

ESD Capability, Machine Model

-

200

V

500

V

40

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.