CY2292
Document #: 38-07449 Rev. *C
Page 4 of 11
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Supply Voltage ............................................... –0.5V to +7.0V
DC Input Voltage............................................ –0.5V to +7.0V
Storage Temperature ................................. –65
°C to +150°C
Max. Soldering Temperature (10 sec) ......................... 260
°C
Junction Temperature .................................................. 150
°C
Package Power Dissipation...................................... 750 mW
Static Discharge Voltage.............................................
≤ 2000V
(per MIL-STD-883, Method 3015)
Operating Conditions[5]
Parameter
Description
Part Numbers
Min.
Max.
Unit
VDD
Supply Voltage, 5.0V operation
All
4.5
5.5
V
VDD
Supply Voltage, 3.3V operation
All
3.0
3.6
V
TA
Commercial Operating Temperature, Ambient
CY2292/CY2292F
0
+70
°C
Industrial Operating Temperature, Ambient
CY2292I/CY2292FI
−40
+85
°C
CLOAD
Max. Load Capacitance 5.0V Operation
All
25
pF
CLOAD
Max. Load Capacitance 3.3V Operation
All
15
pF
fREF
External Reference Crystal
All
10.0
25.0
MHz
External Reference Clock[6, 7, 8]
All
1
30
MHz
Electrical Characteristics, Commercial 5.0V
Parameter
Description
Conditions
Min. Typ. Max. Unit
VOH
HIGH-Level Output Voltage
IOH = 4.0 mA
2.4
V
VOL
LOW-Level Output Voltage
IOL = 4.0 mA
0.4
V
VIH
HIGH-Level Input Voltage[9]
Except crystal pins
2.0
V
VIL
LOW-Level Input Voltage[9]
Except crystal pins
0.8
V
IIH
Input HIGH Current
VIN = VDD – 0.5V
<1
10
µA
IIL
Input LOW Current
VIN = +0.5V
<1
10
µA
IOZ
Output Leakage Current
Three-state outputs
250
µA
IDD
VDD Supply Current[10] Commercial
VDD = VDD max., 5V operation
75
100
mA
IDDS
VDD Power Supply Current in Shutdown Mode[10] Shutdown active CY2292/CY2292F
10
50
µA
Electrical Characteristics, Commercial 3.3V
Parameter
Description
Conditions
Min. Typ.
Max.
Unit
VOH
HIGH-Level Output Voltage
IOH = 4.0 mA
2.4
V
VOL
LOW-Level Output Voltage
IOL = 4.0 mA
0.4
V
VIH
HIGH-Level Input Voltage[9]
Except crystal pins
2.0
V
VIL
LOW-Level Input Voltage[9]
Except crystal pins
0.8
V
IIH
Input HIGH Current
VIN = VDD – 0.5V
< 1
10
µA
IIL
Input LOW Current
VIN = +0.5V
< 1
10
µA
IOZ
Output Leakage Current
Three-state outputs
250
µA
IDD
VDD Supply Current[10] Commercial
VDD = VDD Max., 3.3V operation
50
65
mA
IDDS
VDD Power Supply Current in Shutdown Mode[10] Shutdown active CY2292/CY2292F
10
50
µA
Notes:
5. Electrical parameters are guaranteed by design with these operating conditions, unless otherwise noted.
6. External input reference clock must have a duty cycle between 40% and 60%, measured at VDD/2.
7. Please refer to application note “Crystal Oscillator Topics” for information on AC-coupling the external input reference clock.
8. The oscillator circuit is optimized for a crystal reference and for external reference clocks up to 20 MHz. For external reference clocks above 20 MHz, it is
recommended that a 150
Ω pull-up resistor to VDD be connected to the Xout pin.
9. Xtal inputs have CMOS thresholds.
10. Load = Max., VIN = 0V or VDD, Typical (–104) configuration, CPUCLK = 66 MHz. Other configurations will vary. Power can be approximated by the following
formula (multiply by 0.65 for 3V operation): IDD=10+0.06•(FCPLL+FUPLL+2•FSPLL)+0.27•(FCLKA+FCLKB+FCLKC+FCLKD+FCPUCLK+FXBUF).
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