11 / 12 page
CY25811/12/14
Document Number: 38-07112 Rev. *F
Page 11 of 12
Package Drawing and Dimensions
Figure 5. 8-Pb (150-Mil) SOIC S8
Figure 6.
8-Pb Thin Shrunk Small Outline Package (4.40 MM Body) Z8
SEATING PLANE
PIN1ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X 45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
1
4
58
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
51-85066-*C
8
PIN1ID
SEATING
PLANE
1
BSC.
BSC
0°-8°
PLANE
GAUGE
2.90[0.114]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
3.10[0.122]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
51-85093-*A
[+] Feedback
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
