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PS9601_01 Datasheet(PDF) 6 Page - NEC

Part No. PS9601_01
Description  HIGH ISOLATION VOLTAGE HIGH SPEED PHOTOCOUPLER
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Maker  NEC [NEC]
Homepage  http://www.nec.com/
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EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES
• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only)
• Internet: http://WWW.CEL.COM
08/06/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
PS9601, PS9601L
RECOMMENDED SOLDERING CONDITIONS
INFRARED RAY REFLOW TEMPERATURE PROFILE
(1) Precautions in mounting the devices by infrared reflow soldering
Peak reflow temperature
235 ˚C or below (plastic surface temperature)
Reflow time
30 seconds or less (Time period during which the plastic surface temperature
is 210 ˚C
Number of reflows Processes
One
Flux
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
(2) Precautions in mounting the devices in solder dip method
Temperature
260 ˚C or below
Time
10 seconds or less
Flux
Rosin group flux, where the amount of chloride component is small.
Time (s)
120 to 160
ßC
60 to 120 s
(pre-heat)
(Actual heat)
to 10 s
to 30 s
235
ßC Peak
210
ßC
Peak Temperature 230 ºC
or Lower




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