M29W800FB-KGD

Product test flow

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Product test flow

Numonyx implements quality assurance procedures throughout the product test flow. In

addition, an off-line quality monitoring program is implemented to ensure that Numonyx’s

KGD devices have the same level of reliability as the standard packaged devices.

Figure 3 gives an overview of Numonyx’s known good die test flow.

The burn-in step performs an electrical stress on the devices by executing write/erase

cycles at 125 °C. This ensures that all the devices that fail early are removed from the

population before proceeding to the following steps.

The electrical wafer sort 1 (EWS1) step applies the same test procedure for both packaged

and KGD devices. After EWS1, only wafers with a minimum yield are accepted for the

following steps (minimum yield rule).

The KGD1 test emulates the final test of packaged devices and is validated after correlating

the results with standard test flow for packaged devices, to ensure the same reliability level

for both test flows. The same test can be reproduced at a lower temperature (KGD2).

Figure 3.

Known good die test flow

1.

EWS = electrical wafer sort.

AI11002

EWS1 @ 85 ˚C

Bake 24 hrs @ 250 ˚C

Laser repair

KGD1 @ 85 ˚C

Packaging and

shipment

DC parameters

Funtionality

Programmability

Erasability

Data retention

Fuse options setting

Laser check for redundancy

DC parameters

Funtionality

Programmability

Erasability

AC parameters

Visual inspection and QA acceptance

KGD2 @ lower

temperature

Early failures scrap

Burn-in on wafer