LUXEON V Portable Datasheet DS40 (8/06)

6

Absolute Maximum Ratings

Emitter

Table 7.

P

Pa

arra

am

me

ette

err

W

Wh

hiitte

e

DC Forward Current (mA)

[1]

700

Peak Pulsed Forward Current (mA)

1000

Average Forward Current (mA)

700

ESD Sensitivity

[2]

± 16,000V HBM

LED Junction Temperature (°C)

135

AluminumCore PCB Temperature ( C)

[3]

70

Storage Temperature (°C)

40 to +120

Soldering Temperature (°C)

[4]

260 for 5 seconds max

Notes for Table 7:

1.

Proper current derating must be observed to maintain junction temperature below the maximum. For more information,

consult the LUXEON Design Guide, available upon request.

2.

LEDs are not designed to be driven in reverse bias. Please consult Philips Lumileds' application brief AB11 for further

information.

3.

based on thermal resistance of Star assembly.

4.

Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120°C. LUXEON emitters

cannot be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective

heating of the leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may

not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and

the board is required. Please consult Philips Lumileds' Application Brief AB10 on LUXEON Emitter Assembly Information

for further details on assembly methods.

0.0

0.2

0.4

0.6

0.8

1.0

350

400

450

500

550

600

650

700

750

800

Wavelength (nm)

Figure 1. White Color Spectrum of typical CCT part, integrated measurement.

Wavelength