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IXDN404SIA Datasheet(PDF) 3 Page - IXYS Corporation |
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IXDN404SIA Datasheet(HTML) 3 Page - IXYS Corporation |
3 / 11 page 3 IXDN404 / IXDI404 / IXDF404 Unless otherwise noted, T A = 25 o C, 4.5V ≤ V CC ≤ 35V . All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel. Electrical Characteristics Symbol Parameter Test Conditions Min Typ Max Units VIH High input voltage 4.5V ≤ VCC ≤ 18V 2.5 V VIL Low input voltage 4.5V ≤ VCC ≤ 18V 0.8 V VIN Input voltage range -5 VCC + 0.3 V IIN Input current 0V ≤ VIN ≤ VCC -10 10 µA VOH High output voltage VCC - 0.025 V VOL Low output voltage 0.025 V ROH Output resistance @ Output High VCC = 18V 2 2.5 Ω ROL Output resistance @ Output Low VCC = 18V 1.5 2 Ω IPEAK Peak output current VCC = 18V 4 A IDC Continuous output current 1 A tR Rise time CL=1800pF Vcc=18V 16 18 ns tF Fall time CL=1800pF Vcc=18V 13 17 ns tONDLY On-time propagation delay CL=1800pF Vcc=18V 36 40 ns tOFFDLY Off-time propagation delay CL=1800pF Vcc=18V 35 39 ns VCC Power supply voltage 4.5 18 35 V ICC Power supply current VIN = 3.5V VIN = 0V VIN = + VCC 1 0 3 10 10 mA µA µA Absolute Maximum Ratings (Note 1) Parameter Value Supply Voltage 40V All Other Pins -0.3V to VCC + 0.3V Junction Temperature 150oC Storage Temperature -65oC to 150oC Soldering Lead Temperature (10 seconds maximum) 300oC Operating Ratings Specifications Subject To Change Without Notice Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Thermal Resistance (To Ambient) 8 Pin PDIP (PI) ( θ JA) 120 K/W 8 Pin SOIC (SIA) 110 K/W 16 Pin SOIC (SIA-16) ( θ JA) 110 K/W θ JA with heat sink ** Heat sink area of 1 cm2 8 Pin SOIC 95 K/W 16 Pin SOIC-CT 95 K/W Heat sink area of 3 cm 2 8 Pin SOIC 85 K/W 16 Pin SOIC-CT 85 K/W ** Device soldered to metal back pane. Heat sink area is 1 oz. copper on 1 side of 0.06" thick FR4 PC board. Parameter Value Operating Temperature Range -55 oC to 125 oC Thermal Resistance (Junction to Case) (θ JC) 8 Pin SOIC (SI) 16 Pin SOIC (SI-16) 10 K/W 10 K/W |
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