NCV8518A

http://onsemi.com

4

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

-0.3 to 45

V

Output Voltage

-0.3 to +7.0

V

RESET Voltage

V

RESET Current

Internally

Limited

mA

ESD Susceptibility (Human Body Model)

-

2.0

kV

Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay)

-

-0.3 to +7.0

V

Operating Junction Temperature

-40 to150

°C

Storage Temperature Range

-55 to +150

°C

Moisture Sensitivity Level

SOIC-16 EP (Case 751R)

SOIC-8 EP (Case 751AC)

MSL

2

2

Lead Temperature Soldering: Reflow

Leaded Part

60-150 sec above 183

°C, 30 sec max at peak

Lead-Free Part

60-150 sec above 217

°C, 40 sec max at peak

-

-

240 peak

265 peak

°C

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Parameter

Board/Mounting Conditions Typical Value

Unit

SO-8 Exposed Pad Package

minimum-pad board (Note 1)

1 sq. inch spreader board (Note 2)

Junction to case top (

19

8

°C/W

Junction to pin1 (

68

63

°C/W

Junction to board (

9

10

°C/W

235

57

°C/W

SO-16 Exposed Pad Package

minimum-pad board (Note 3)

1 sq. inch spreader board (Note 2)

Junction to case top (

30

16

°C/W

Junction to pin1 (

70

65

°C/W

Junction to board (

15

17

°C/W

150

55

°C/W

Specific notes on thermal characterization conditions:

All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical

values are derived from an axisymmetric finite-element model where active die area, total die area, flag area, pad area, and board area are

equated to the actual corresponding areas.

1. 1 oz copper, 6 x 9 mm, 0.062” thick FR-4.

4.

“board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it

best represents the primary heat flow path and is least sensitive to board and ambient properties.