Electronic Components Datasheet Search |
|
NCV8518APDG Datasheet(PDF) 4 Page - ON Semiconductor |
|
NCV8518APDG Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 13 page NCV8518A http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage VIN, ENABLE -0.3 to 45 V Output Voltage VOUT -0.3 to +7.0 V RESET Voltage VRESET 0 V to VOUT V RESET Current (RESET may be incidentally shorted either to VOUT or to GND without damage) IRESET Internally Limited mA ESD Susceptibility (Human Body Model) - 2.0 kV Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay) - -0.3 to +7.0 V Operating Junction Temperature TJ -40 to150 °C Storage Temperature Range TS -55 to +150 °C Moisture Sensitivity Level SOIC-16 EP (Case 751R) SOIC-8 EP (Case 751AC) MSL 2 2 Lead Temperature Soldering: Reflow Leaded Part 60-150 sec above 183 °C, 30 sec max at peak Lead-Free Part 60-150 sec above 217 °C, 40 sec max at peak - - 240 peak 265 peak °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Parameter Board/Mounting Conditions Typical Value Unit SO-8 Exposed Pad Package minimum-pad board (Note 1) 1 sq. inch spreader board (Note 2) Junction to case top ( Y-JT, qJT) 19 8 °C/W Junction to pin1 ( Y-JL1, qJL1) 68 63 °C/W Junction to board ( Y-JB, qJB)3 9 10 °C/W Junction to ambient (RqJA, qJA) 235 57 °C/W SO-16 Exposed Pad Package minimum-pad board (Note 3) 1 sq. inch spreader board (Note 2) Junction to case top ( Y-JT, qJT) 30 16 °C/W Junction to pin1 ( Y-JL1, qJL1) 70 65 °C/W Junction to board ( Y-JB, qJB) (Note 4) 15 17 °C/W Junction to ambient (RqJA, qJA) 150 55 °C/W Specific notes on thermal characterization conditions: All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical values are derived from an axisymmetric finite-element model where active die area, total die area, flag area, pad area, and board area are equated to the actual corresponding areas. 1. 1 oz copper, 6 x 9 mm, 0.062” thick FR-4. 2. 1 oz copper, 645 mm2 (1in2) spreader area (includes exposed pad). 3. 1 oz copper, 17.2 mm2 spreader area (minimum exposed pad, not including traces which are assumed). 4. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it best represents the primary heat flow path and is least sensitive to board and ambient properties. |
Similar Part No. - NCV8518APDG |
|
Similar Description - NCV8518APDG |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |