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SN74LVC3G07DCTRE4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC3G07DCTRE4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 12 page www.ti.com FEATURES 3A 3 2 5 8 1 1A VCC 3Y GND DCT PACKAGE (TOP VIEW) DCU PACKAGE (TOP VIEW) 3 2 4 5 1 1A VCC 1Y 3Y GND 3Y GND VCC 2Y 2A See mechanical drawings for dimensions. 2 5 3 4 8 2A 3A 2Y 2A 1Y 2Y 4 6 7 6 7 8 6 1 7 1A 3A 1Y YZP PACKAGE (BOTTOM VIEW) DESCRIPTION/ORDERING INFORMATION SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES365J – AUGUST 2001 – REVISED FEBRUARY 2007 • Available in the Texas Instruments • Typical V OHV (Output VOH Undershoot) >2 V at NanoFree™ Package V CC = 3.3 V, TA = 25°C • Supports 5-V V CC Operation • I off Supports Partial-Power-Down Mode Operation • Max t pd of 3.7 ns at 3.3 V • Latch-Up Performance Exceeds 100 mA Per • Low Power Consumption, 10-µA Max I CC JESD 78, Class II • ±24-mA Output Drive at 3.3 V • ESD Protection Exceeds JESD 22 • Input and Open-Drain Output Accepts – 2000-V Human-Body Model (A114-A) Voltages up to 5.5 V – 200-V Machine Model (A115-A) • Typical V OLP (Output Ground Bounce) <0.8 V at V CC = 3.3 V, TA = 25°C – 1000-V Charged-Device Model (C101) This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC3G07YZPR _ _ _CV 0.23-mm Large Bump – YZP (Pb-free) SSOP – DCT Reel of 3000 SN74LVC3G07DCTR C07_ _ _ –40°C to 85°C Reel of 3000 SN74LVC3G07DCUR VSSOP – DCU C07_ Reel of 250 SN74LVC3G07DCUT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2001–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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