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ADS61B23 Datasheet(PDF) 3 Page - Texas Instruments |
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ADS61B23 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 51 page  www.ti.com ABSOLUTE MAXIMUM RATINGS (1) ADS61B23 SLAS582 – FEBRUARY 2008 PACKAGE/ORDERING INFORMATION(1) SPECIFIED PACKAGE- PACKAGE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT TEMPERATURE LEAD DESIGNATOR MARKING NUMBER QUANTITY RANGE ADS61B23IRHBT Tape and Reel, 250 ADS61B23 QFN-32(2) RHB –40 °C to 85°C AZ61B23 ADS61B23IRHBR Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θ JA = 34 °C/W (0 LFM air flow), θ JC = 30 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in × 3 in (7.62 cm × 7.62 cm) PCB. VALUE UNIT Supply voltage range, AVDD –0.3 to 3.9 V VI Supply voltage range, DRVDD –0.3 to 3.9 V Voltage between AGND and DRGND –0.3 to 0.3 V Voltage between AVDD to DRVDD –0.3 to 3.3 V Voltage applied to VCM pin (in external reference mode) –0.3 to 2 V Voltage applied to analog input pins, INP and INM –0.3 to minimum ( 3.6, AVDD + 0.3) V Voltage applied to analog input pins, CLKP and CLKM –0.3 to (AVDD + 0.3) V TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range 125 °C Tstg Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): ADS61B23 |
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