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PX1011B Datasheet(PDF) 3 Page - NXP Semiconductors |
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PX1011B Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 30 page PX1011B_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 19 March 2008 3 of 30 NXP Semiconductors PX1011B PCI Express stand-alone X1 PHY 4. Ordering information 5. Marking [1] Industrial temperature range. Table 2. Ordering information Type number Solder process Package Name Description Version PX1011B-EL1/G Pb-free (SnAgCu solder ball compound) LFBGA81 plastic low profile fine-pitch ball grid array package; 81 balls; body 9 × 9 × 1.05 mm SOT643-1 PX1011BI-EL1/G Pb-free (SnAgCu solder ball compound) LFBGA81 plastic low profile fine-pitch ball grid array package; 81 balls; body 9 × 9 × 1.05 mm SOT643-1 Table 3. Lead-free package marking Line Marking Description A PX1011B-EL1/G PX1011BI-EL1/G[1] full basic type number B xxxxxxx diffusion lot number C 2PGyyww manufacturing code: 2 = diffusion site P = assembly site G = lead-free yy = year code ww = week code |
Similar Part No. - PX1011B |
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Similar Description - PX1011B |
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