M29W040-150NZ6R datasheet(6/31 Pages) STMICROELECTRONICS

Part #	M29W040-150NZ6R

Description	4 Mbit 512Kb x8, Uniform Block Low Voltage Single Supply Flash Memory

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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Memory Blocks

The memory blocks of the M29W040 are shown in

Figure 3. The memory array is divided in 8 uniform

blocks of 64 Kbytes. Each block can be erased

separately or any combination of blocks can be

erased simultaneously. The Block Erase operation

is managed automaticallyby the P/E.C. The opera-

tion can be suspended in order to read from any

other block, and then resumed.

Block Protection provides additional data security.

Each uniform block can be separately protected or

unprotectedagainst Program or Erase. Bringing A9

and G to VID initiates protection, while bringing A9,

G and E to VID cancels the protection. The block

affected during protection is addressed by the in-

puts on A16, A17, and A18. Unprotect operation

affects all blocks.

Operations

Operations are defined as specific bus cycles and

signals which allow Memory Read, Command

Write, Output Disable, Standby, Read Status Bits,

Block Protect/Unprotect, Block Protection Check

and ElectronicSignature Read. They are shown in

Tables 3, 4, 5.

Read. Read operations are used to output the

contents of the Memory Array, the Status Register

or the Electronic Signature. Both Chip Enable E

and Output Enable G must be low in order to read

the output of the memory. The Chip Enable input

also provides power control and shouldbe used for

device selection. Output Enable should be used to

gate dataonto the outputindependentof the device

selection. The data read depends on the previous

command written to the memory (see instructions

RST and RSIG, and Status Bits).

Write. Write operationsare used to give Instruction

Commands to the memory or to latch input data to

be programmed. A write operation is initiated when

Chip Enable E is Low and Write Enable W is Low

with Output Enable G High. Addresses are latched

on the falling edge of W or E whichever occurs last.

Commands and Input Data are latchedon the rising

edge of W or E whichever occurs first.

Output Disable. The data outputs are high imped-

ance when the Output Enable G is High with Write

Enable W High.

Standby. The memory is in standby when Chip

Enable E is High and Program/Erase Controller

P/E.C. is Idle. The power consumption is reduced

to the standby level and the outputs are high im-

pedance, independent of the Output Enable G or

Write Enable W inputs.

Automatic Standby. After 150ns of inactivity and

when CMOS levels are driving the addresses, the

chip automatically enters a pseudo standby mode

where consumption is reduced to the CMOS

standby value, while outputs are still driving the

bus.

Power Down. When the PD command is written

to the P/E.C. the memory enters a power down

status where the power consumption is reduced to

ICC6 (typically less than 1.0

µA).

Electronic Signature. Two codes identifying the

manufacturer and the device can be read from the

memory, the manufacturer’s code for STMicroelec-

tronics is 20h, and the device code is E3h for the

M29W040. These codes allow programming

equipment or applications to automatically match

their interface to the characteristics of the particular

manufacturer’s product. The Electronic Signature

is output by a Read operation when the voltage

applied to A9 is at VID and address inputs A1 and

A6 are at Low. The manufacturer code is output

when the Address input A0 is Low and the device

code when this input is High. Other Address inputs

are ignored. The codes are output on DQ0-DQ7.

This is shown in Table 4.

The Electronic Signature can also be read, without

raising A9 to VID by giving the memory the instruc-

tion RSIG (see below).

6/31

M29W040

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