Cautions and warnings

General

EPCOS thermistors are designed for specific applications and should not be used for purposes

not identified in our specifications, application notes and data books unless otherwise agreed

with EPCOS during the design-in-phase.

Ensure suitability of thermistor through reliability testing during the design-in phase. The

thermistors should be evaluated taking into consideration worst-case conditions.

Storage

Store thermistors only in original packaging. Do not open the package before storage.

Storage conditions in original packaging: storage temperature

25

°C ... +45 °C, relative

humidity

≤75% annual mean, maximum 95%, dew precipitation is inadmissible.

Avoid contamination of thermistors surface during storage, handling and processing.

Avoid storage of thermistor in harmful environment with effect on function on long-term

operation (examples given under operation precautions).

Use thermistor within 6 months after delivery.

Handling

PTCs must not be dropped. Chip-offs must not be caused during handling of PTCs.

Components must not be touched with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Soldering

Use rosin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Mounting

Electrode must not be scratched before/during/after the mounting process.

Contacts and housing used for assembly with thermistor have to be clean before mounting.

Especially grease or oil must be removed.

When PTC thermistors are encapsulated with sealing material, the precautions given in chapter

"Mounting instructions", "Sealing and potting" must be observed.

When the thermistor is mounted, there must not be any foreign body between the electrode of

the thermistor and the clamping contact.

The minimum force of the clamping contacts pressing against the PTC must be 10 N.

During operation, the thermistor’s surface temperature can be very high. Ensure that adjacent

components are placed at a sufficient distance from the thermistor to allow for proper cooling at

the thermistors.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of thermistor. Be sure that surrounding parts and materials can withstand

this temperature.

Avoid contamination of thermistor surface during processing.

Switching applications

for electronic ballast

C1118, S1076

Page 4 of 6

Please read Important notes and

Cautions and warnings at the end of this document.