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ILD621-X009 Datasheet(PDF) 2 Page - Vishay Siliconix |
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ILD621-X009 Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 10 page www.vishay.com For technical questions, contact: optocoupler.answers@vishay.com Document Number: 83654 2 Rev. 1.5, 20-Dec-07 ILD621/ILD621GB/ILQ621/ILQ621GB Vishay Semiconductors Optocoupler, Phototransistor Output (Dual, Quad Channel) Note For additional information on the available options refer to option information. Notes (1) Tamb = 25 °C, unless otherwise specified. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. (2) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). ILD621-X007 CTR > 50 %, dual, SMD-8 (option 7) ILD621-X009 CTR > 50 %, dual, SMD-8 (option 9) ILD621GB-X007 CTR > 100 %, dual, SMD-8 (option 7) ILQ621-X006 CTR > 50 %, quad, DIP-16 400 mil ILQ621-X007 CTR > 50 %, quad, SMD-16 (option 7) ILQ621-X009 CTR > 50 %, quad, SMD-16 (option 9) ILQ621GB-X006 CTR > 100 %, quad, DIP-16 400 mil ILQ621GB-X007 CTR > 100 %, quad, SMD-16 (option 7) ILQ621GB-X009 CTR > 100 %, quad, SMD-16 (option 9) ORDER INFORMATION PART REMARKS ABSOLUTE MAXIMUM RATINGS (1) PARAMETER TEST CONDITION PART SYMBOL VALUE UNIT INPUT Reverse voltage VR 6.0 V Forward current IF 60 mA Surge current IFSM 1.5 A Power dissipation Pdiss 100 mW Derate from 25 °C 1.33 mW/°C OUTPUT Collector emitter reverse voltage VECO 70 V Collector current IC 50 mA t < 1.0 ms IC 100 mA Power dissipation Pdiss 150 mW Derate from 25 °C - 2.0 mW/°C COUPLER Isolation test voltage t = 1.0 s VISO 5300 VRMS Package dissipation ILD621 400 mW ILD621GB 400 mW Derate from 25 °C 5.33 mW/°C Package dissipation ILQ621 500 mW ILQ621GB 500 mW Derate from 25 °C 6.67 mW/°C Creepage distance ≥ 7.0 mm Clearance distance ≥ 7.0 mm Isolation resistance VIO = 500 V, Tamb = 25 °C RIO ≥ 1012 Ω VIO = 500 V, Tamb = 100 °C RIO ≥ 1011 Ω Storage temperature Tstg - 55 to + 150 °C Operating temperature Tamb - 55 to + 100 °C Junction temperature Tj 100 °C Soldering temperature (2) 2.0 mm from case bottom Tsld 260 °C |
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