S1PHB15

Single Phase Half Controlled Bridge With Free Wheeling Diode

F ig. 3 S urge overload current per chip

I

F ig. 5 Max. forward current at

heatsink temperature

per chip

F ig. 6 P ower dissipation versus direct output current and ambient temperature

F ig. 7 T ransient thermal impedance junction to heatsink per chip

C onstants for Z

i

R

t

1

0.34

0.0344

2

1.16

0.12

3

1.5

0.5