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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

TPS650240

,, TPS650241

TPS650242, TPS650243

TPS650244, TPS650245

SLVS774A – JUNE 2007 – REVISED DECEMBER 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

VOLTAGE AT

OUTPUT CURRENT ON DCDC1

VOLTAGE AT

PACKAGE

DCDC3

/ DCDC2 / DCDC3

VDD_ALIVE

1.0V / 1.3V

1.0A / 0.8A / 0.8A

1.2V

TPS650240RHB

0.9V / 1.375V

1.6A / 1.0A / 0.8A

1.2V

TPS650241RHB

1.0V / 1.5V

1.0A / 0.8A / 0.8A

1.2V

TPS650242RHB

–40

°C to

32 Pin QFN

85

°C

(RHB)

1.0V / 1.2V

1.6A / 1.0A / 0.8A

1.2V

TPS650243RHB

1.55V / 1.6V

0.8A / 1.6A / 0.8A

1.2V

TPS650244RHB

0.9V / 1.1V

1.0A / 0.8A / 0.8A

1.1V

TPS650245RHB

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

The RHB package is available in tape and reel. Add R suffix (TPS650240RHBR) to order quantities of 3000 parts per reel. Add T suffix

(TPS650240RHBT) to order quantities of 250 parts per reel.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Input voltage range on all pins except A/PGND pins with respect to AGND

–0.3 to 7

V

Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3

2000

mA

Peak current at all other pins

1000

mA

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature

–40 to 85

°C

Maximum junction temperature

125

°C

Storage temperature

–65 to 150

°C

Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DERATING FACTOR

POWER RATING

POWER RATING

POWER RATING

RHB

35K/W

2.85W

28mW/K

1.57W

1.14W

(1)

The thermal resistance junction to ambient of the RHB package is measured on a high K board. The thermal resistance junction to

power pad is 1.5k/W.

2

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