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ABSOLUTE MAXIMUM RATINGS

(1) (2)

DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

UCC28230

UCC28231

SLUS814 – FEBRUARY 2008

ORDERING INFORMATION

TEMPERATURE RANGE,

REFERENCE

PACKAGE

TAPE AND REEL QTY

PART NUMBER

VOLTAGE

5 V

250

UCC28230DRNT

5 V

3000

UCC28230DRNR

Plastic 12-pin

SON (DRN)

3.3 V

250

UCC28231DRNT

3.3 V

3000

UCC28231DRNR

-40

°C to +125°C

5 V

250

UCC28230PWT

5 V

2000

UCC28230PWR

Plastic 14-pin

TSSOP (PW)

3.3 V

250

UCC28231PWT

3.3 V

2000

UCC28231PWR

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

VDD

-0.3 to 20.0

O1_D, O2_D, O1_DIN, O2_DIN

-0.3 to VDD +0.3

Inputs voltages on OS, CS, SS, RT, OST

-0.3 to 6.3

V

Output voltage on VREF

-0.3 to 5.6

HBM

ESD rating,

2k

CDM

ESD rating

500

Continuous total power dissipation

NoLabel

Operating virtual junction temperature range,

-40 to +150

Operating ambient temperature range,

-40 to +125

°C

Storage temperature,

-65 to +150

Lead temperature (Soldering, 10 sec.)

+300

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

These devices are sensitive to electrostatic discharge; follow proper device handling procedures.

(3)

All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See

Packaging Section of the datasheet for thermal limitations and considerations of packages.

DERATING

FACTOR

BOARD

PACKAGE

POWER

POWER

POWER

RATING

RATING

RATING

25

°C

DRN

PW

110

°C

9.07mW/

°C

907 mW

(1)

These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different

packages. The cooling condition and thermal impedance R

θJA of practical design is specific.

(2)

The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and

2-oz top and bottom trace layers (preliminary data based on modeling)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage range

7

12

17

V

Operating junction temperature range

-40

125

°C

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Product Folder Link(s): UCC28230 UCC28231