2005.3.2

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Reflow Soldering Conditions

Manual Soldering Conditions

Iron tip temp.

Soldering time and frequency

3 s

1 time

350 ℃

(MAX.)

(MAX.)

(MAX.) (30 W Max.)

PS1191RB

Surface Mount Phototransistor/Reverse Mount Type

1) The above profile temperature gives the maximum temperature of the device resin surface.

Please set the temperature so as to avoid exceeding this range.

2) Total times of reflow soldering process shall be no more than 2 times.

When the second reflow soldering process is performed, intervals between the first

and second reflow should be short as possible (while allowing some time for the

component to return to normal temperature after the first reflow) in order to prevent the

device from absorbing moisture.

3) Temperature fluctuation to the device during the pre-heating process shall be minimized.