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RBO08-40T Datasheet(PDF) 10 Page - STMicroelectronics |
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RBO08-40T Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 14 page SUBSTRATES AND MOUNTING INFORMATION The use of epoxy FR4 boards is quite common for surface mounting techniques, however, their poor thermal conduction compromises the otherwise outstanding thermal performance of the PowerSO-10. Some methods to overcome this limitation are discussed below. One possibility to improve the thermal conduction is the use of large heat spreader areas at the copper layer of the PC board. This leads to a reduction of thermal resistance to 35 °C for 6 cm2 of the board heatsink (see fig. 2). Use of copper-filled through holes on conventional FR4 techniques will increase the metallization and decrease thermal resistance accordingly. Using a configurationwith 16 holes under the spreader of the package with a pitch of 1.8 mm and a diameter of 0.7 mm, the thermal resistance (junction - heatsink) can be reduced to 12 °C/W (see fig. 3). Beside the thermal advantage, this solution allows multi-layer boards to be used. However, a drawback of this traditional material prevents its use in very high power, high current circuits. For instance, it is not advisable to surface mount devices with currents greater than 10 A on FR4 boards. A Power Mosfet or Schottky diode in a surface mount power package can handle up to around 50 A if better substrates are used. Fig. 2 : Mounting on epoxy FR4 head dissipation by extending the area of the copper layer Fig. 3 : Mounting on epoxy FR4 by using copper-filled through holes for heat transfer FR4 board Copper foil FR4 board Copper foil heat transfer heatsink ® RBO08-40G / RBO08-40M / RBO08-40T 10/14 |
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