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1N5936BUR-1 Datasheet(PDF) 1 Page - Microsemi Corporation |
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1N5936BUR-1 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page METALLURGICALLY BONDED GLASS SURFACE MOUNT 1.5 WATT ZENERS SCOTTSD A L E DIVISION 1N5913BUR-1 thru 1N5956BUR-1 (or MLL5913B thru MLL5956B) DESCRIPTION APPEARANCE This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection for applications of high density and low parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced internal contacts, it may also be used for high reliability applications when required by a source control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in Features below. Zener voltage tolerance options are identified by part number suffix including tight-tolerance. A variety of other Zener product offerings and packages are available by Microsemi to meet higher or lower power and test current applications. DO-213AB IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Electrically similar to the JEDEC registered 1N5913B thru 1N5956B zener series • Zener voltages available 3.3V to 200V • Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers, e.g. MX1N5913BUR-1, MV1N5923CUR-1, MSP1N5952DUR-1, etc. • Surface mount equivalents also available as SMBJ5913B to SMBJ5956B, SMBG5913B to SMBG5956B, SMAJ5913B to SMAJ5956B, or as 1PMT5913B to 1PMT5956B (see separate data sheets) • Plastic body axial-leaded Zener equivalents are also available as 1N5913BP to 1N5956BP (see separate data sheet) • Regulates voltage over a broad operating current and temperature range • Wide selection from 3.3 to 200 V • Leadless package for surface mounting • Ideal for high density mounting • Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance • Standard voltage tolerances are +/- 5% with B suffix and 10 % with A suffix identification • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Nonsensitive to ESD • Hermetically sealed glass package • Specified capacitance (see Figure 2) • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING • Power dissipation at 25ºC: 1.5 watts (also see derating in Figure 1). • Operating and Storage temperature: -65ºC to +175ºC • Thermal Resistance: 40 ºC/W junction to end cap, or 120 ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page) • Steady-State Power: 1.50 watts at TEC < 115oC, or 1.25 watts at TA = 25 ºC when mounted on FR4 PC board and recommended footprint as described for thermal resistance (also see Figure 1) • Forward voltage @200 mA: 1.2 volts (maximum) • Solder Temperatures: 260 ºC for 10 s (max) • CASE: Hermetically sealed DO-213AB glass MELF package • TERMINALS: End caps, tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation • MARKING: Cathode band only • TAPE & REEL optional: Standard per EIA-481-B with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel (add “TR” suffix to part number) • WEIGHT: 0.05 grams • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2005 1-04-2005 REV D |
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