MSC0995.PDF

ISO 9001 CERTIFIED

REV F 11/01/99

8700 E. Thomas Road

Scottsdale, AZ 85251

Tel: (480) 941-6300

Fax: (480) 947-1503

DESCRIPTION

In Microsemi's Powermite

®

surface mount package, these zener diodes

provide power-handling capabilities (3.0 WATTS) found in larger packages.

In addition to its size advantages, Powermite

®

package features include a

full metallic bottom that eliminates the possibility of solder flux entrapment

during assembly, and a unique locking tab acts as an integral heat sink. Its

innovative design makes this device ideal for use with automatic insertion

equipment.

FEATURES

•

Surface Mount Packaging

•

Integral Heat Sink Locking Tabs

•

Compatible with automatic insertion equipment

•

Full metallic bottom eliminates flux entrapment

•

Zener voltage 3.3 to 200 Volts

MAXIMUM RATINGS

Packaging

•

Junction and storage temperatures: -55

°C to +150°C

••

Tape & Reel EIA Standard 481

•

DC power dissipation: 3.0 watt with TAB 1

60°C

•

Forward voltage:

@ 200 mA 1.2 volts

Mechanical Specifications

Mounting Pad Dimensions

POWERMITE

®

3.0 WATT

Zener Diodes

1PMT5913B

thru

1PMT5956B

MECHANICAL CHARACTERISTICS

•

Cathode designated by TAB 1

•

Mounting position any way

•

Molded package

•

Weight: 0.016 gram (approximate)

•

Thermal resistance 30°C/W junction to TAB1

PACKAGING

•

Tape & Reel EIA Standard 481

•

7 inch 3,000 pieces

•

13 inch 12,000 pieces

CIRCUIT DIAGRAM

DO-216

All dimensions +/- .005 inches

Inches