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TPS78633KTTRG3 Datasheet(PDF) 11 Page - Texas Instruments

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Part # TPS78633KTTRG3
Description  ULTRALOW-NOISE, HIGH-PSRR, FAST, RF, 1.5-A LOW-DROPOUT LINEAR REGULATORS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS78633KTTRG3 Datasheet(HTML) 11 Page - Texas Instruments

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T
J + TA ) PDmax
R
qJA
(6)
R
qJA +
T
J * TA
P
Dmax
(7)
15
20
25
30
35
40
0.1
1
10
100
PCB Copper Area (cm2)
No Air Flow
150 LFM
250 LFM
DDPAK POWER DISSIPATION
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
with 25 Thermal Vias
Thermal Vias,
0.3 mm Diameter,
1.5 mm Pitch
P
Dmax + (5 * 2.5) V
1 A + 2.5 W
(8)
R
qJA
max + (125 * 55)°C 2.5 W + 28°C W
(9)
TPS786xx
SLVS389G – SEPTEMBER 2002 – REVISED JULY 2006
Even if no external black body radiator type heatsink
From Figure 27, DDPAK Thermal Resistance vs
is attached to the package, the board on which the
Copper Heatsink Area, the ground plane needs to be
regulator is mounted provides some heatsinking
1 cm2 for the part to dissipate 2.5 W. The operating
through the pin solder connections. Some packages,
environment used in the computer model to construct
like the DDPAK and SOT223 packages, use a
Figure 27 consisted of a standard JEDEC High-K
copper plane underneath the package or the circuit
board (2S2P) with a 1 oz. internal copper plane and
board ground plane for additional heatsinking to
ground plane. The package is soldered to a 2 oz.
improve their thermal performance. Computer-aided
copper pad. The pad is tied through thermal vias to
thermal modeling can be used to compute very
the 1 oz. ground plane. Figure 28 shows the side
accurate approximations of an integrated circuit's
view of the operating environment used in the
thermal
performance
in
different
operating
computer model.
environments (for example, different types of circuit
boards, different types and sizes of heatsinks,
different air flows, etc.). Using these models, the
three thermal resistances can be combined into one
thermal resistance between junction and ambient
(RθJA). This RθJA is valid only for the specific
operating environment used in the computer model.
Equation 5 simplifies into Equation 6:
Rearranging Equation 6 gives Equation 7:
Using Equation 6 and the computer model generated
curves shown in Figure 27 and Figure 30, a designer
can quickly compute the required heatsink thermal
resistance/board
area
for
a
given
ambient
temperature,
power
dissipation,
and
operating
Figure 27. DDPAK Thermal Resistance
environment.
vs PCB Copper Area
The DDPAK package provides an effective means of
managing
power
dissipation
in
surface
mount
applications. The DDPAK package dimensions are
provided in the mechanical drawing section at the
end of the data sheet. The addition of a copper plane
directly underneath the DDPAK package enhances
the thermal performance of the package.
To illustrate, the TPS78625 in a DDPAK package
was chosen. For this example, the average input
voltage is 5 V, the output voltage is 2.5 V, the
average
output
current
is
1
A,
the
ambient
temperature 55
°C, the air flow is 150 LFM, and the
operating environment is the same as documented
below.
Neglecting
the
quiescent
current,
the
maximum average power is shown in Equation 8:
Figure 28. DDPAK Thermal Resistance
Computer Model
Substituting TJmax for TJ into Equation 6 gives
Equation 9:
11
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