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EMK13G2J-50.000MTR Datasheet(PDF) 2 Page - Ecliptek Corporation |
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EMK13G2J-50.000MTR Datasheet(HTML) 2 Page - Ecliptek Corporation |
2 / 2 page MANUFACTURER CATEGORY SERIES PACKAGE VOLTAGE CLASS REV .DATE ECLIPTEK CORP. OSCILLATOR EMK13 PLASTIC 3.3V OS5M 11/07 MECHANICAL DIMENSIONS ALL DIMENSIONS IN MILLIMETERS ENVIRONMENTAL/MECHANICAL SPECIFICATIONS TAPE AND REEL DIMENSIONS ALL DIMENSIONS IN MILLIMETERS SUGGESTED SOLDER PAD LAYOUT ALL DIMENSIONS IN MILLIMETERS 800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice. EMK13 H 2 H - 50.000M TR PART NUMBERING GUIDE AVAILABLE OPTIONS Blank=Bulk TR=Tape and Reel (Standard) FREQUENCY FREQUENCY TOLERANCE & STABILITY/ OPERATING TEMPERATURE RANGE G=±100ppm Maximum over -40°C to +85°C H=±50ppm Maximum over -40°C to +85°C DUTY CYCLE 2=50% ±5% LOGIC CONTROL H=Tri-State (High Impedance) J=Power Down (Logic Low) A B C D E F 16.0 ±0.3 7.5 ±0.2 6.75 ±0.2 4.0 ±0.2 2.0 ±0.2 F G H J K L 8.0 ±0.2 A0* 1.5 ±0.1 B0* 0.30 ±0.05 K0* TAPE M N O P Q 1.5 MIN 50 MIN 20.2 MIN 13.0 ±0.2 40 MIN R S T U V QTY/REEL 2.5 MIN 10 MIN 22.4 MAX 180 MAX 16.4 +2/-0 1,000 REEL *Compliant to EIA 481C Tolerances= +0.1 2.00 (x4) 2.20 (x4) 1.81 2.88 PLASTIC MEMS First™ is a registered trademark of SiTime Corporation. MARKING SPECIFICATIONS Pad 1: Tri-State or Power Down Pad 2: Case Ground Pad 3: Output Pad 4: Supply Voltage Line 1: XXXX Ecliptek Manufacturing Lot Code Characteristic Specification ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM: 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G 5.00 ±0.15 7.00 ±0.15 0.85 ±0.15 0.08 MAX 0.20 ±0.10 2.60 ±0.15 1.40 ±0.10 (x4) 1.20 ±0.10 (x4) 2.1 2 1 3 4 1.70 R0.70 ±0.10 5.08 ±0.10 A Note: Solder connection to the bottom four I/O pads of the package only. Note A: Center Paddle is No Connect. C0.25 ±0.10 |
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