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EM623FT8DT10S Datasheet(PDF) 3 Page - Emerging Memory & Logic Solutions Inc |
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EM623FT8DT10S Datasheet(HTML) 3 Page - Emerging Memory & Logic Solutions Inc |
3 / 11 page EM620FV8B Series Low Power, 256Kx8 SRAM 3 FUNCTIONAL SPECIFICATIONS There are 3 classifications for EMLSI die and wafers products, which are C1 and C2 for die and W1 and W2 for wafer, respectively. Each die and wafer support dedicated characteristics and probe the electrical parameters within their specifications. Followings are brief information for die and wafer classifications. Please refer to packaged specifications for more information but these parameters are not guaranteed at bare die and wafer. − C1 LEVEL DIE OR W1 LEVEL WAFER The DC parameters are measured by specification for C1 level die or W1 level wafer. The DC parameters measured at 70 °C tem- perature, which called ‘Hot DC Sorting’ Other parameters are not guaranteed and warranted including device reliability. Please refer to qualification report for device reliability and package level datasheets for electrical parameters. − C2 LEVEL DIE OR W2 LEVEL WAFER The DC parameters and selected AC parameters are measured with for C2 level die or W2 level wafer. The DC characteristics of C2 die and W2 wafer is tested based on DC specifications of C1 level die and W1 level wafer. The DC and specified AC parameters are tested at 70 °C temperature, which called ‘Hot DC & Selective AC Sorting’. Other parameters are not guaranteed and warranted including device reliability. Please refer to qualification report for device reliability and package level datasheets for electrical param- eters. C2 level die and W2 level wafer probe following AC parameter. − tRC, tAA, tCO − tWC, tCW PACKAGING Individual device will be packed in anti-static trays. − Chip Trays : A 2-inch square waffle style carrier for die with separate compartments for each die. Commonly referred to as a waffle pack, each tray has a cavity size selected for the device that allows for easy loading and unloading and prevents rotation. The tray itself is made of conductive material to reduce the danger of damage to the die from electrostatic discharge. The chip carriers will be labeled with the following information : − EMLSI wafer lot number − EMLSI part number − Quantity − Jar Packing : Jar packing is made by EMLSI and used by many customers that we deliver the requested die as wafer. The pack is consisted of clean paper to wrap the wafer, high cushioned sponge between wafers and hardly fragile plastic box with sponge. Each pack has typically 24 wafers and then several packs are put into larger box depending on amounts of wafers. STORAGE AND HANDLING EMLSI recommends the die stored in a controlled environment with filtered nitrogen. The carrier must be opened at ESD safe environment when inspection and assembly. Bond Pad #1 at Top Die orientation in chip carriers |
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