Part Numbering Scheme

MVL-6

A

B

C

D

where A = Leadframe Orientation

where C = Color Option

and Package Dimension

"UROK" = 632 nm Ultra Red

"3" = Parallel Leadframe (3.10 X 3.95 mm)

"NUOL" = 625 nm Red

"5" = Parallel Leadframe ( 4.26 X 5.06 mm )

"UOL" = 625 nm Red

"6" = Perpendicular Leadframe (4.70 X 5.70 mm)

"TUOL" = 625 nm Red

"7" = Parallel Leadframe ( 3.80 X 5.20 mm )

"SO" = 605 nm Orange

"8" = Parallel Leadframe ( 4.56 X 5.20 mm )

"UYL" = 590 nm Amber

"9" = Perpendicular Leadframe ( 4.60 X 5.60 mm )

"TUYL" = 590 nm Amber

"UG" = 573 nm Green

"HTG / UTG" = 525 mm True Green

"HB / UB" = 470 mm Blue

where B = Package Color

where D = Standoff Option

"1" = color diffuse

"N/A" = Without

"2" = diffuse

"-S" = With Stopper

"3" = Matching Color

"4" = Water Clear

"UROK"

"UOL"

"SO"

"UYL"

"HTG"

"UTG"

"TUOL"

"HB"

"UB"

"TUYL"

"UG"

mA

mW

mA

V

V

30

125

100

50

105

100

-40 to + 100

N/A

-30 to + 100

300

NOTE1

-40 to + 100

N/A

5

-20 to + 85

5

-20 to + 80

5

-20 to + 85

Storage Temp

Solder Temperature

Peak Forward Current(1/10 Duty Cycle 100

µs pulse width)

Electrostatic Discharge Threshold

DC Forward Current

Operating Temp Range

Power Dissipation

1000

30

125

100

260

[ 1.5mm ( 0.06 in. ) below seating plane ]

Parameter

Units

InGaN

InGaN

5

-20 to + 80

-30 to + 100

100

AlInGaP

AlInGaP

30

70

"NUOL"

Notes: 1. Product resistance to electrostatic discharge (ESD) is measured by simulating ESD using a rapid avalanche energy test (RAET).

The RAET procedures are designed to approximate the maximum ESD ratings shown. Seller gives no other assurances regarding

the ability of Products to withstand ESD.

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