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RMS132UAF-10E Datasheet(PDF) 2 Page - Emerging Memory & Logic Solutions Inc |
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RMS132UAF-10E Datasheet(HTML) 2 Page - Emerging Memory & Logic Solutions Inc |
2 / 26 page Advance Information The specifications of this device are subject to change without notice. For latest documentation see http://www.emlsi.com. 2 RMS132UAW Figure1: Bond Pad Layout (TOP View) • Deep Trench Process • 3 Metal Layers including Local Inter-connection •Top Metal : Al-Cu • Typical Pad Size : 70um X 70um • Wafer Diameter : 8 inch (0,0) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 X Y Pad 53 Pad 52 70um 75um 217um (2332.4, 5826.8) |
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