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EMP116MAAF Datasheet(PDF) 11 Page - Emerging Memory & Logic Solutions Inc |
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EMP116MAAF Datasheet(HTML) 11 Page - Emerging Memory & Logic Solutions Inc |
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11 / 11 page  EMP116MAAF Series 1Mx16 Pseudo Static RAM Preliminary Rev 0.0 A1 corner index area A E2(Seating plane) A B C D E F G H 6 5 4 3 2 1 B B1 B/2 B PACKAGE DIMENSION 48 Ball Fine Pitch BGA (0.75mm ball pitch) Bottom View Top View C D(Diameter) Min. Typ. Max. A - 0.75 - B 5.90 6.00 6.10 B1 - 3.75 - C 7.90 8.00 8.10 C1 - 5.25 - D 0.30 0.35 0.40 E - 1.00 1.10 E1 - 0.75 - E2 0.20 0.25 0.30 R - - 0.08 NOTES 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. All dimensions are millimeters. 3. Dimension “D” is measured at the maximum solder ball diameter in a plane parallel to datum C. 4. Primary datum C (Seating plane) is defined by the crown of the solder balls. 5. This is a controlling dimension. Side View Detail A A1 index Mark C 5 3 4 A R |
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