-5-

Nichia

STSE-CC7031A

<Cat.No.070309>

(4) Designing the position of LED on a board.

· No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder

to avoid a crack of LED package.

Refer to the following recommended position and direction of LED.

【No good】

【Recommended Direction】

Appropriate LED mounting is to place perpendicularly against the stress affected side.

· Depending on the position and direction of LED, the mechanical stress on the LED package can be

changed.

Refer to the following figure.

Perforated line

Slit

Stress : A > B = C > D > E

· Do not split board by hand.

Split with exclusive special tool.

· If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack.

For this reason, it is recommended an appropriate verification should be taken before use.

Cathode mark

Cathode mark

E

A

C

D

B