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ADS5463IPFPG4 Datasheet(PDF) 2 Page - Texas Instruments |
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ADS5463IPFPG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 37 page ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS (1) ADS5463 SLAS515B – NOVEMBER 2006 – REVISED MAY 2008 .................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION SPECIFIED PACKAGE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD TEMPERATURE DESIGNATOR(1) MARKING NUMBER MEDIA, QUANTITY RANGE ADS5463IPFP Tray, 96 HTQFP-80(2) ADS5463 PFP –40 °C to 85°C ADS5463I PowerPAD ADS5463IPFPR Tape and reel, 1000 (1) For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Thermal pad size: 6.15 mm × 6.15 mm (min), 7.5 mm × 7.5 mm (maximum), see Thermal Pad Addendum located at the end of the data sheet. over operating free-air temperature range (unless otherwise noted) (1) ADS5463 UNIT AVDD5 to GND 6 V Supply voltage AVDD3 to GND 5 V DVDD3 to GND 5 V Analog input to Valid when supplies are on and within normal ranges. See additional –0.3 to (AVDD5 + 0.3) V GND information in the Power Supplies portion of the applications information in the back of the datasheet regarding Clock and Analog Inputs when the Clock input to GND –0.3 to (AVDD5 + 0.3) V supplies are off. CLK to CLK ±2.5 V Digital data output –0.3 to (DVDD3 + 0.3) V to GND Operating temperature range –40 to 85 °C Maximum junction temperature 150 °C Storage temperature range –65 to 150 °C ESD, human-body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon request. PARAMETER TEST CONDITIONS TYP UNIT Soldered thermal pad, no airflow 23.7 (2)RθJA Soldered thermal pad, 150-LFM airflow 17.8 °C/W Soldered thermal pad, 250-LFM airflow 16.4 (3)RθJP Bottom of package (thermal pad) 2.99 °C/W (1) Using 36 thermal vias (6 × 6 array). See PowerPAD Package in the Application Information section. (2) RθJA is the thermal resistance from the junction to ambient. (3) RθJP is the thermal resistance from the junction to the thermal pad. 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s) :ADS5463 |
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