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BOND PAD ASSIGNMENT

VCC_IN

OUT+

5

1

2

3

RSSI_IB

OUT-

9

6

7

4

10

12

16 15 14

13

8

VCC_OUT

18 17

RSSI_EB

11

19

NC

GND

ONET8501T

SLLS884 – FEBRUARY 2008

The ONET8501T is available in die form. The locations of the bondpads are shown in Figure 2.

Figure 2. Bond Pad Assignment of ONET8501T

TERMINAL FUNCTIONS

TERMINAL

TYPE

DESCRIPTION

NAME

NO.

4, 8,

Circuit ground. All GND pads are connected on die. Bonding all pads is optional; however, for

GND

Supply

optimum performance a good ground connection is mandatory.

13–19

OUT+

1

Analog output

Non-inverted CML data output. On-chip 50

VCC_OUT

2

Supply

2.97V–3.63V supply voltage for the voltage and CML amplifiers.

VCC_IN

3

Supply

2.97V–3.63V supply voltage for input TIA stage.

Bias voltage for photodiode cathode. These pads are internally connected to an 220

Ω resistor

FILTER

5, 7

Analog

IN

6

Analog input

Data input to TIA (photodiode anode).

Optional use when operated with external PD bias (e.g. APD). Analog output current

proportional to the input data amplitude. Indicates the strength of the received signal

RSSI_EB

10

Analog output

(RSSI).Connected to an external resistor to ground (GND). For proper operation, ensure that

pad should be left open.

Analog output current proportional to the input data amplitude. Indicates the strength of the

received signal (RSSI) if the photo diode is biased from the TIA. Connected to an external

RSSI_IB

9

Analog output

resistor to ground (GND). For proper operation, ensure that the voltage at the RSSI pad does

OUT–

12

Analog output

Inverted CML data output. On-chip 50

Copyright © 2008, Texas Instruments Incorporated

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Product Folder Link(s): ONET8501T