ABSOLUTE MAXIMUM RATINGS

(1)

PIN CONFIGURATIONS

1

2

3

4

5

10

9

8

7

6

OutB

-InB

+InB

A1

A0

+V

S

NC

(1)

OutA

-InA

+InA

NC

(1)

-INA

+INA

GND

NC

(1)

-INB

+INB

A1

1

2

3

4

12

11

10

9

OPA2673

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

OPA2673IRGVT

Tape and Reel, 250

OPA2673

QFN-16

RGV

–40°C to +85°C

OPA2673

OPA2673IRGVR

Tape and Reel, 2500

OPA2673IDGQ

Rails, 80

MSOP-10

DGQ

–40°C to +85°C

OPA2673

PowerPAD™

OPA2673IDGQR

Tape and Reel, 2500

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Available 3Q 2008.

Over operating free-air temperature range (unless otherwise noted).

PARAMETER

OPA2673

UNIT

Power supply

±6.5

Internal power dissipation

See Thermal Characteristics

Differential input voltage

±2

V

Input common-mode voltage range

V

Storage temperature range: DGQ, RGV packges

–40 to +125

C

Lead temperature soldering

+300

°C

+150

°C

Continuous operating junction temperature

+139

°C

Human body model (HBM)

2000

V

ESD

Charge device model (CDM)

1500

V

rating:

Machine model (MM)

200

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

RGV PACKAGE(2)

DGQ PACKAGE(2)(3)

QFN-16

MSOP-10

(TOP VIEW)

(TOP VIEW)

(1)

NC = Not connected.

(2)

(3)

Available 3Q 2008.

2

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Copyright © 2008, Texas Instruments Incorporated

Product Folder Link(s): OPA2673