ESDALC6V1-1BM2

Package information

5/10

3

Package information

●

Epoxy meets UL94, V0

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Note:

Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin 1

mark is to be used for this purpose.

Table 3.

SOD882 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.40

0.47

0.50

0.016 0.019 0.020

A1

0.00

0.05

0.000

0.002

b1

0.20

0.25

0.30

0.008 0.010 0.012

b2

0.20

0.25

0.30

0.008 0.010 0.012

D

1.00

0.039

E

0.60

0.024

e

0.65

0.026

L1

0.45

0.50

0.55

0.018 0.020 0.022

L2

0.45

0.50

0.55

0.018 0.020 0.022

INDEX AREA

(D/2 x E/2)

INDEX AREA

(D/2 x E/2)

OPTIONAL

PIN # 1 ID

D

E

A1

A

b1

e

b2

L2

L1

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Figure 11.

Footprint (dimensions in mm) Figure 12.

Marking

0.55

0.40

0.50

0.55

P

Pin1

Pin 2