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XC6214P122JL Datasheet(PDF) 10 Page - Torex Semiconductor |
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XC6214P122JL Datasheet(HTML) 10 Page - Torex Semiconductor |
10 / 26 page 10/26 XC6214 Series ● TO-252 Power Dissipation Board Mount (Tj max = 125℃) Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W) 25 1800 85 720 55.56 ■POWER DISSIPATION (TO-252) (Continued) Pd-Ta特性グラフ 0 200 400 600 800 1000 1200 1400 1600 1800 2000 25 45 65 85 105 125 周辺温度Ta(℃) Pd-Ta特性グラフ 0 200 400 600 800 1000 1200 1400 1600 1800 2000 25 45 65 85 105 125 周辺温度Ta(℃) Power dissipation data for the TO-252 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Operating temperature Pd vs. Ta Ambient Temperature Ta (℃) |
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