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SMA6F13A Datasheet(PDF) 5 Page - STMicroelectronics |
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SMA6F13A Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 9 page SMA6F Characteristics 5/9 Figure 6. Peak forward voltage drop versus peak forward current (typical values) Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm 2) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, copper thickness = 35 µm) Figure 9. Leakage current versus junction temperature (typical values) I (A) FM 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 0.0 0.5 1.0 1.5 2.0 T j =25 °C T j =125 °C V (V) FM Zth(j-a)/Rth(j-a) 0.00 0.01 0.10 1.00 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 On recommended pad layout t (S) p Rth(j-a)(°C/W) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 S (cm ) CU 2 I (nA) R 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 25 50 75 100 125 150 175 V R=VRM V BR=11.7V V BR>11.7V T (°C) j |
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