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ORLI10G-1BMN680I Datasheet(PDF) 3 Page - Lattice Semiconductor

Part # ORLI10G-1BMN680I
Description  Quad 2.5Gbps, 10Gbps Quad 3.125Gbps, 12.5Gbps Line Interface FPSC
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ORLI10G-1BMN680I Datasheet(HTML) 3 Page - Lattice Semiconductor

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Lattice Semiconductor
ORCA ORLI10G Data Sheet
3
– New LUT structure allows flexible combinations of LUT4, LUT5, new LUT6, 4 : 1 MUX, new 8 : 1 MUX, and
ripple mode arithmetic functions in the same PFU.
– 32 x 4 RAM per PFU, configurable as single- or dual-port. Create large, fast RAM/ROM blocks (128 x 8 in
only eight PFUs) using the SLIC decoders as bank drivers.
– Soft-Wired LUTs (SWL) allow fast cascading of up to three levels of LUT logic in a single PFU through fast
internal routing, which reduces routing congestion and improves speed.
– Flexible fast access to PFU inputs from routing.
– Fast-carry logic and routing to all four adjacent PFUs for nibble-wide, byte-wide, or longer arithmetic func-
tions, with the option to register the PFU carry-out.
• Abundant high-speed buffered and nonbuffered routing resources provide 2x average speed improvements over
previous architectures.
• Hierarchical routing optimized for both local and global routing with dedicated routing resources. This results in
faster routing times with predictable and efficient performance.
• SLIC provides eight 3-stable buffers, up to a 10-bit decoder, and PAL™-like AND-OR-INVERT (AOI) in each pro-
grammable logic cell.
• New 200 MHz embedded quad-port RAM blocks, two read ports, two write ports, and two sets of byte lane
enables. Each embedded RAM block can be configured as:
– 1—512 x 18 (quad-port, two read/two write) with optional built-in arbitration.
– 1—256 x 36 (dual-port, one read/one write).
– 1—1k x 9 (dual-port, one read/one write).
– 2—512 x 9 (dual-port, one read/one write for each).
– 2 RAMs with arbitrary number of words whose sum is 512 or less by 18 (dual-port, one read/one write).
– Supports joining of RAM blocks.
– Two 16 x 8-bit Content Addressable Memory (CAM) support.
– FIFO 512 x 18, 256 x 36, 1k x 9, or dual 512 x 9.
– Constant multiply (8 x 16 or 16 x 8).
– Dual variable multiply (8 x 8).
• Embedded 32-bit internal system bus plus 4-bit parity interconnects FPGA logic, MicroProcessor Interface (MPI),
embedded RAM blocks, and embedded standard cell blocks with 100 MHz bus performance. Included are built-
in system registers that act as the control and status center for the device.
• Built-in testability:
– Full boundary scan (IEEE 1149.1 and draft 1149.2 JTAG) for the programmable I/Os only.
– Programming and readback through boundary-scan port compliant to IEEE Draft 1532:D1.7.
– TS_ALL testability function to 3-state all I/O pins.
– New temperature-sensing diode.
• Improved built-in clock management with Programmable Phase-Locked Loops (PPLLs) provides optimum clock
modification and conditioning for phase, frequency, and duty cycle from 20 MHz up to
420 MHz. Multiplication of input frequency up to 64x and division of input frequency down to 1/64x is possible.
• New cycle stealing capability allows a typical 15% to 40% internal speed improvement after final place and route.
This feature also supports compliance with many setup/hold and clock-to-out I/O specifications, and may provide
reduced ground bounce for output buses by allowing flexible delays of switching output buffers.


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