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616LP3E Datasheet(PDF) 8 Page - Hittite Microwave Corporation |
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616LP3E Datasheet(HTML) 8 Page - Hittite Microwave Corporation |
8 / 10 page 5 5 - 243 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Outline Drawing Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC616LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 616 XXXX HMC616LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 616 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information HMC616LP3 / 616LP3E v00.0508 GaAs SMT PHEMT LOW NOISE AMPLIFIER, 175 - 660 MHz |
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