© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN7383 Rev. 1.0.3

5

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In

addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

Notes:

2. When mounted on 76.2 x 114.3 x 1.6mm PCB. (FR-4 glass epoxy material).

3. Please refer to:

JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection

JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Min.

Max.

Unit

High-side offset voltage

V

High-side floating supply voltage

-0.3

625

V

High-side floating output voltage HO1, HO2

V

Low-side and logic fixed supply voltage

-0.3

25

V

Low-side output voltage LO1, LO2

-0.3

V

Logic input voltage (IN)

-0.3

V

Shutdown logic input voltage

-0.3

V

Dead-time control voltage

-0.3

5.0

V

GND

Logic ground

V

Allowable offset voltage slew rate

50

V/ns

(2)(3)(4)

Power dissipation

1.0

W

θ

JA

Thermal resistance, junction-to-ambient

110

°C/W

Junction temperature

150

°C

Storage temperature

150

°C

Symbol

Parameter

Condition

Min.

Max.

Unit

High-side floating supply voltage

V

High-side floating supply offset voltage

600

V

Low-side supply voltage

15

20

V

High-side (HO) output voltage

V

Low-side (LO) output voltage

GND

V

Logic input voltage (IN)

GND

V

Ambient temperature

-40

125

°C