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FSAV332MTCX Datasheet(PDF) 7 Page - Fairchild Semiconductor |
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FSAV332MTCX Datasheet(HTML) 7 Page - Fairchild Semiconductor |
7 / 9 page © 2004 Fairchild Semiconductor Corporation www.fairchildsemi.com FSAV332 • Rev. 1.0.3 7 Physical Dimensions SIDE VIEW TOP VIEW DETAIL A END VIEW LAND PATTERN RECOMMENDATION Figure 9. 16-Lead, Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150-inch Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ |
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