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MMA6270QT Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MMA6270QT Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 12 page Sensors Freescale Semiconductor 7 MMA6270QT MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. The flag underneath the package is internally connected to ground. It is not recommended for the flag to be soldered down. Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for Consumer Grade Products and Applications Pin 1 ID (non-metallic) Note: The die pad (flag) is not generally recommended to be soldered down for consumer product application. All dimensions are in mm. Do not solder down flag and 4 corner ground pads on the package for consumer application Do not place any top metal patterns or via structures beneath the package |
Similar Part No. - MMA6270QT_08 |
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Similar Description - MMA6270QT_08 |
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